The Rambus HBM3E / HBM3 controller cores are designed for use in applications requiring high memory bandwidth and low latency inc…
- Controller
High Bandwidth Memory (HBM) IP encompasses the controller, PHY, and associated interface logic required to connect SoCs, AI accelerators, GPUs, and HPC processors to HBM memory stacks through advanced 2.5D and 3D packaging technologies.
HBM interfaces provide extremely high memory bandwidth through wide parallel buses, multiple independent channels, and low-power signaling. Modern implementations support HBM2E, HBM3, HBM3E, and emerging HBM4 standards, enabling memory subsystems that deliver multi-terabyte-per-second bandwidth while maintaining high energy efficiency.
This catalog includes HBM controllers, PHYs, verification IP, and subsystem solutions designed for advanced-node ASICs targeting AI training and inference, high-performance computing, networking, and data center applications. Solutions can be compared based on supported HBM generation, bandwidth, channel architecture, reliability features, packaging requirements, and foundry process compatibility.
The Rambus HBM3E / HBM3 controller cores are designed for use in applications requiring high memory bandwidth and low latency inc…
Bandwidth and area optimized low power memory interface solution tuned for AI, HPC, data centers and networking conforming to HBM…
High Bandwidth Memory 3 (HBM3/3E) IP optimized for Samsung SF4X
The HBM3 IP consists of a PHY and memory controller optimized for Samsung SF4X process to support the HBM3 memory standard (JESD2…
Highest performance, lowest power and area