Vendor: Cadence Design Systems, Inc. Category: HBM

HBM3 PHY

Highest performance, lowest power and area

PHY View all specifications

Overview

The Cadence High-Bandwidth Memory generation 3 (HBM3) PHY is optimized for systems that require the highest-bandwidth, low-latency memory solution. The memory subsystem PHY supports data rates up to 8.4Gbps per data pin, featuring 16 independent channels, for a total data width of 1024 bits. The PHY is designed for a 2.5D system with a silicon interposer to route signals between the 3D DRAM stack and PHY. The third-generation design is optimized for low power consumption and low PHY area. Cadence provides the complete solution including PHY, interposer, and package.

Key features

  • Advanced clocking architecture minimizes clock jitter
  • DFI PHY Independent Mode for initialization and training
  • IEEE 1500 interface, Memory BIST feature, and loop-back function
  • Supports lane repair
  • Designed for optimized interposer routing

Benefits

  • Highest Performance: HBM3E up to 8.4Gbps per pin and HBM2E up to 3.6Gbps per pin
  • Low Latency: For data-intensive applications
  • Low Power and Area: Low-power control and advanced low-power modes with power down
  • Easy integration: PHY is hardened, and timing closed including all I/O and decoupling capacitors
  • Complete HBM Solution: Full system design including PHY, interposer, and package
  • Excellent Support: Access to Cadence expert SI/PI team to support customer designs

Specifications

Identity

Part Number
HBM3 PHY
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP
Controller / PHY
PHY

Files

Product Sheet Download

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Provider

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Frequently asked questions about HBM Interface IP

What is HBM3 PHY?

HBM3 PHY is a HBM IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this HBM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this HBM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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