Overview
An easy-to-use, scalable, and fully automated process to capture IP description in IP-XACT format
Magillem® Packaging uses a data model based on the IP-XACT industry standard to handle all aspects of system integration for connectivity, configurability, and system memory map. It enables true IP reuse methodology with an interoperable design flow for complex SoCs, including register management, IP capture, and SoC IP assembly.
With a nonintrusive, scalable, and automatic process for legacy and new IP that enables seamless IP client portfolio packaging, Magillem Packaging delivers both data accuracy and flexibility. It allows incremental or full packaging with IP-XACT compliance and data consistency that are ensured by construction and assessed with a built-in Magillem IP-XACT checkers suite.
Learn more about System Controller IP core
Interconnect is the Rodney Dangerfield of IP blocks. It gets no respect. It connects hundreds of disparate IP blocks, each with hundreds of interface signals, and dozens of transaction protocol attributes. It does it in a way that each IP need not know the protocol details of any other. It also provides for the data access requirements of each IP, and does it physically distributed across the chip floorplan. Interconnect fabric technology is sophisticated, and very important for modern chip designs. Following are ten reasons why interconnect matters.
The design of system-on-chip (SoC) devices for automotive applications—and the reuse of portions of those designs for future SoC incarnations—just got a lot easier with the recent announcement of the expanded partnership between Arm and Arteris.
On March 24, the 2026 XuanTie RISC-V Ecosystem Conference, hosted by Alibaba DAMO Academy, was held in Shanghai. Hundreds of industry and academic institutions from around the world—including Qualcomm, Arteris, Canonical, SHD Group, Haier, and ZTE—gathered to share cutting-edge practices in RISC-V.
This paper will define AI, describe its applications, the problems it presents, and how designers can address those problems through new and holistic approaches to SoC and network on chip (NoC) design. It also describes challenges implementing AI functionality in automotive SoCs with ISO 26262 functional safety requirements.
This paper explains the changes in the role of the semiconductor industry in the automotive supply chain and seeks to enhance the reader’s knowledge regarding all aspects of the ISO 26262 standard. This paper also discusses the standard’s applicability not only to electronic products, but also to the people and processes employed to create them.
Imagine you have defined the structure of a system-on-chip and now you have to assemble all the IP blocks and make them communicate on the die. You have spent months rigorously selecting SoC IP that reflects the desired chip functionality. However, without the on-chip interconnect fabric it is just a collection of isolated blocks.
