UCIe Controller add-on CXL2 Protocol Layer
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
- UCIe
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
UCIe Controller add-on CXL2 Protocol Layer
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCIe Controller add-on CXL3 Protocol Layer
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCIe Controller baseline for Streaming Protocols for ASIL B Compliant, AEC-Q100 Grade 2
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
UCLe - Ensures reliable validation and efficient connectivity for chiplets
UCIe VIP is a solution for validating and ensuring compliance in multi-chip semiconductor systems.
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
The UCIe Verification IP provides an effective & efficient way to verify the UCIe components of an IP or SoC.
The UCIe 2.0 Verification IP offers a streamlined and efficient solution for verifying UCIe components within an IP or SoC.
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
The UCIe-A 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
UCIe-S PHY for Standard Package (x16) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …