Vendor: Integre Technologies LLC Category: Protocol Bridge

HyperLink High Speed DSP Interface Core

The Integretek HyperLink Core allows the creation of a user defined system which can communicate with remote TI Cx66 DSP devices …

Overview

The Integretek HyperLink Core allows the creation of a user defined system which can communicate with remote TI Cx66 DSP devices via a high speed SERDES interface. The core provides a high-speed communication interface that extends the AXI interface over a serial connection. The HyperLink FPGA core leverages the same proven HyperLink IP used within the TI multi-core DSPs. The core is available with either an industry standard AXI interface or an easy to use DMA interface.

Key features

  • Up to 25Gbps transfer rate (4 lane)
  • Point-to-point connection
  • Link self-initializes
  • Supports multiple outstanding read, write and interrupt transactions
  • Simple packet-based transfer protocol for memory mapped access
  • AXI4 Interface Complies with AMBA AXI Protocol V2.0
  • 64 user defined interrupt inputs, level and pulse sensitive
  • AXI4 Slave (transmit to DSP and Control Register access)
  • AXI4 Master (receive from DSP)
  • Optional DMA interface

Block Diagram

Specifications

Identity

Part Number
IP-HyperLink
Vendor
Integre Technologies LLC
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

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Frequently asked questions about Protocol Bridge IP cores

What is HyperLink High Speed DSP Interface Core?

HyperLink High Speed DSP Interface Core is a Protocol Bridge IP core from Integre Technologies LLC listed on Semi IP Hub.

How should engineers evaluate this Protocol Bridge?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Protocol Bridge IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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