Overview
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing SoCs. The controller interoperates with the Synopsys 112G XSR PHY to deliver a complete Die-to-Die solution for a seamless connection between the on-die interconnect fabrics in both dies via the standard CXS port. The Synopsys Die-to-Die Controller uses
a FLIT-based architecture to minimize latency. It implements an advanced error detection and correction mechanism including Cyclic Redundancy Check (CRC) and optional latency-optimized Forward Error Correction (FEC) to reduce Bit Error Rate (BER) to a very low level for PAM-4 or NRZ PHY
signaling. The embedded retry protocol enables very low latency, error free links between two dies.
The Synopsy Die-to-Die Controller optimizes system performance by supporting two configurations for coherent and non-coherent data traffic between the SoC bus and each die. The latency-optimized configuration interfaces with the SoC fabric via a FLIT-based interface (Arm® CXS). The Synopsys Die-to-Die Controller can be extended to support any aggregate bandwidth between the two dies using bifurcation into multiple parallel links.
Learn more about Custom IP core
Leading portfolio of engineering solutions positions Synopsys to capitalize on the continued expansion of digital and physical AI and the AI-driven transformation of engineering.
The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model, optimized to use Synopsys EDA tools to perform semiconductor design workflows.
The multi-year agreement marks the expansion of Synopsys' silicon IP business to serve increasing demand for application-optimized IP with Amazon as its lead customer.
Open and Secure Synopsys Autopilot Platform Accelerates Engineering Productivity, Improves Design Quality, and Achieves Faster Closure Across Silicon to Systems
New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff
Learn how AVSBus 2.0 VIP validates power delivery in AI and data center SoCs.