Overview
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accelerator, networking and high-performance computing SoCs. The controller interoperates with the Synopsys 112G XSR PHY to deliver a complete Die-to-Die solution for a seamless connection between the on-die interconnect fabrics in both dies via the standard CXS port. The Synopsys Die-to-Die Controller uses
a FLIT-based architecture to minimize latency. It implements an advanced error detection and correction mechanism including Cyclic Redundancy Check (CRC) and optional latency-optimized Forward Error Correction (FEC) to reduce Bit Error Rate (BER) to a very low level for PAM-4 or NRZ PHY
signaling. The embedded retry protocol enables very low latency, error free links between two dies.
The Synopsy Die-to-Die Controller optimizes system performance by supporting two configurations for coherent and non-coherent data traffic between the SoC bus and each die. The latency-optimized configuration interfaces with the SoC fabric via a FLIT-based interface (Arm® CXS). The Synopsys Die-to-Die Controller can be extended to support any aggregate bandwidth between the two dies using bifurcation into multiple parallel links.
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Synopsys extended its long-standing collaboration with Infineon to deliver a Synopsys Virtualizer™ Development Kit (VDK) supporting Infineon’s AURIX™ RC1 microcontroller (MCU) family. The VDK equips automotive engineering teams with a virtual prototype of the AURIX™ RC1 MCU, Infineon’s new scalable computing platform for software-defined vehicle (SDV) and Physical AI applications.
Explore three agentic AI adoption paths that help chip design teams combine flexible AI stacks with trusted, physics-based engineering tools.
Supporting the European Chips Act, startups and research teams will gain access to Synopsys chip design solutions to advance Europe’s strategic goals in areas such as AI and high-performance computing (HPC)
Recognition highlights leadership in agentic AI design, advanced-node enablement, co-packaged optics, and silicon-proven IP for next-generation AI systems
Leading portfolio of engineering solutions positions Synopsys to capitalize on the continued expansion of digital and physical AI and the AI-driven transformation of engineering.
The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model, optimized to use Synopsys EDA tools to perform semiconductor design workflows.