Vendor: Analog Bits Inc. Category: High-Speed

Chip-to-Chip IO Buffer on TSMC CLN5

The Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra- short reach environments, usi…

TSMC 5nm N5 Available on request View all specifications

Overview

The Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra- short reach environments, using single-ended switching for efficient high-density utilization of available inter- chip routing tracks. It features core-voltage-level signal switching for low power and high voltage margin, and an unterminated receiver allowing for maximum signal swing at lowest power in ultra-short reach environments.

The output is tristateable allowing for bi-directional signal flow.

The output driver is implemented in Analog Bits’ proprietary architecture that uses core devices only.

Chip-to-Chip IO Buffer Characteristics Description Symbol Min Typ Max Units I/O Bit Rate FCLK 0 1000 Mb/s DC Output Drive (high @ VDD/2) IOH 12.5 mA DC Output Drive (low @ VDD/2) IOL 12.5 mA Capacitance of the PAD pin CPIN 1.5 pF Maximum Load @1000Mbps CL 1.5 pF TX Mode Power @800Mbps at runlength=2 P 0.65 mW RX Mode Power @800Mbps at runlength=2 P 0.07 mW Hysteresis (when enabled) 5 10 % of VDD Operational Voltage (Core supply) VDD 0.65 0.725 0.8 V Operational Voltage (IO supply) VDDA 0.65 0.725 0.8 V Operational Temperature TOP -40 25 125 C Total area of macro A 0.0031 sq.mm Dimensions: 60.231um (X) by 52.08um (Y) Table 1: Operational Specifications

Key features

  • Single-Ended CMOS IO
  • DC to 1Gb/s operation
  • Core voltage CMOS signaling
  • Low power consumption
  • Built-in ESD protection
  • Requires no additional on-chip components or band-gaps, minimizing power consumption

Silicon Options

Foundry Node Process Maturity
TSMC 5nm N5 Available on request

Specifications

Identity

Part Number
Chip-to-Chip IO Buffer on TSMC CLN5
Vendor
Analog Bits Inc.
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about High-Speed IP core

M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C

With the rapid growth of AR/VR and high-resolution imaging systems such as drones and action cameras, MIPI CSI (Camera Serial Interface) and MIPI DSI (Display Serial Interface) require both high data throughput and low power consumption. M31 provides a MIPI C-PHY and D-PHY IP combo solution implemented on TSMC N3P and N3C processes.

High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits

Today, High-Speed SerDes serves as the foundation of industry standards such as PCIe, Ethernet, USB, and UCIe, making it a critical technology for modern semiconductor systems. As the industry progresses towards higher data rates and increasingly complex architectures, SerDes continues to play a central role in enabling reliable and scalable connectivity, especially at lower nodes.

PCIe 5.0: The universal high-speed interconnect for High Bandwidth and Low Latency Applications Design Challenges & Solutions

Innosilicon, a leading IP provider, offers a complete PCIe 5.0 solution stack that includes both PHY and controller IPs. Although both layers are crucial to achieving a fully compliant and high-performance PCIe interface, this paper deep dives into the technical challenges of PHY design, highlighting insights drawn from real-world design margins, receiver robustness, and advanced jitter analysis in the context of Gen5 systems.

Frequently asked questions about High-Speed I/O Pad IP

What is Chip-to-Chip IO Buffer on TSMC CLN5?

Chip-to-Chip IO Buffer on TSMC CLN5 is a High-Speed IP core from Analog Bits Inc. listed on Semi IP Hub. It is listed with support for tsmc Available on request.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP