Vendor:
IMEC
Category:
Wi-Fi
802.11ah ULP Wifi Radio
imec’s ULPWIFI Radio is a pre-standard design for the upcoming IEEE 802.11ah standard (draft D5.0) and supports the mandatory 1MH…
Overview
imec’s ULPWIFI Radio is a pre-standard design for the upcoming IEEE 802.11ah standard (draft D5.0) and supports the mandatory 1MHz and 2MHz channel modes, optimized for low power as well as extended range. Its RF and analog design (including ADC) is implemented on chip, and its digital baseband is implemented in FPGA. OFDM-based BPSK/QPSK/QAM16 modes are supported. It achieves excellent performance at ultra low power consumption and operates in the sub-1GHz industrial, scientific and medical (ISM) and short-range devices (SRD) bands, from 863MHz to 930MHz.
Key features
- IEEE 802.11ah (Sub-1GHz) Wi-Fi support
- 0.15-3.9Mbps PHY data rates
- 4.0mW Tx; 7.5mW Rx for 8dBm peak output power
Applications
- Communications
- Data processing
- Consumer Electronics
- Automotive
- Industrial and medical
What’s Included?
- Whitebox IP license (including CDS, schematic, layout, extracted, testbenches, scripts, matlab model, a.o. ) with technology transfer training and support
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 40nm | ULP eFlash | Silicon Proven |
Specifications
Identity
Part Number
802.11ah ULP Wifi Radio
Vendor
IMEC
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
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Frequently asked questions about Wi-Fi IP cores
What is 802.11ah ULP Wifi Radio?
802.11ah ULP Wifi Radio is a Wi-Fi IP core from IMEC listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.
How should engineers evaluate this Wi-Fi?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Wi-Fi IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.