Faraday Reports Third Quarter 2026 Results
Third quarter consolidated revenue reached NT$3,664 million, up 11% QoQ and 13% YoY.
Vendor:
Faraday Technology
Category:
LPDDR
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
Overview
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| UMC | 40nm | LP | — |
Specifications
Identity
Part Number
FXDDR4D16FC101HH0L
Vendor
Faraday Technology
Type
Silicon IP
Controller / PHY
Controller + PHY
,
PHY
Provider
HQ:
Taiwan
Learn more about LPDDR IP core
Faraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IP
To address the growing demand for intelligent sensing, Faraday has expanded its MIPI C/D Combo PHY IP portfolio on UMC’s 14nm FinFET platform. T
A design path to success exists for ultra-low-voltage SoCs
The alien realm of ultra-low voltage (ULV) in chip design means supply voltages near or below transistor threshold voltages.
Faraday Reports Second Quarter 2026 Results
Second quarter consolidated revenues were NT$3,314 million, up 28% QoQ but down 27% YoY.
Crypto mining SoC unearths a need for custom IP
Would custom memory ease your SoC design?
A case study shows how custom memory design can adapt to functional, timing, or layout requirements of a particular SoC.
Frequently asked questions about LPDDR Interface IP
What is 40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage?
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage is a LPDDR IP core from Faraday Technology listed on Semi IP Hub. It is listed with support for umc.
How should engineers evaluate this LPDDR?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this LPDDR IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.