The Riddle Of 450mm
May 10, 2010
The whole 450mm wafer thing is a puzzle. Last week at IEF 2010, there was TSMC's CTO Jack Sun, saying he wanted and expected 450mm to happen while, listening to him in the audience, was Heinz Kundert, European CEO of SEMI whose members make the chip manufacturing equipment, who said later: "We don't want it."
To read the full article, click here
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related Blogs
- What's happening on the 450mm wafer front?
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
Latest Blogs
- Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
- The Role of GPU in AI: Tech Impact & Imagination Technologies
- Time-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
- Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
- Deep Robotics and Arm Power the Future of Autonomous Mobility