Cadence Design Systems, Inc.
•
HQ:
USA
High-performance, low-latency PHY for D2D connectivity The UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more …
- GlobalFoundries
- 12nm
- LP
- Silicon Proven
Compare 23 D2D PHY IP Listing from 16 vendors
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Neuron IP Inc.• HQ: Canada
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
- UCIe
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
Global UniChip Corp. (GUC)• HQ: TaiwanIGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
- TSMC
- 5nm
- N5FF
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Cadence Design Systems, Inc.• HQ: USA
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
- Verification IP
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Ventana Micro Systems Inc.• HQ: USA
Streamline Ventana technology integration into high-performance systems, fully leveraging third-party IP, while applying RISC-V s…
- CPU
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UCIe D2D Adapter & PHY Integrated IP
Chip Interfaces ApS• HQ: DenmarkA UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
- UCIe
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D2D Controller addon for D2D SR112G PHY with CXS interface
Synopsys, Inc.• HQ: USAThe Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…
- Custom
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Ventana Micro Systems Inc.• HQ: USA
The second-generation high-performance RISC-V CPU delivers a major leap in compute capability, designed for deployment across dat…
- CPU
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Chip Interfaces ApS• HQ: Denmark
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
- UCIe
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Chip Interfaces ApS• HQ: Denmark
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
- UCIe
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Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
Racyics GmbH• HQ: GermanyThe Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.
- GlobalFoundries
- 22nm
- FDX
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InPsy• HQ: Taiwan (R.O.C.)
Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…
- Custom
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Blue Cheetah Analog Design, Inc.• HQ: USA
BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.
- Custom
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Eliyan• HQ: USA
The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and…
- Custom
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Scalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
Ventana Micro Systems Inc.• HQ: USAScalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
- CPU
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
- UCIe
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
- UCIe
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Innosilicon Technology Ltd• HQ: China
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
- UCIe
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Omni Design Technologies, Inc.• HQ: USA
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
- TSMC
- 16nm
- FFC
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Omni Design Technologies, Inc.• HQ: USA
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
- Samsung
- 8nm