High-performance, low-latency PHY for D2D connectivity The UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more …
- GlobalFoundries
- 12nm
- LP
- Silicon Proven
High-performance, low-latency PHY for D2D connectivity The UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more …
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
TSMC CLN5FF GUCIe LP Die-to-Die PHY
IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face package.
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
Streamline Ventana technology integration into high-performance systems, fully leveraging third-party IP, while applying RISC-V s…
UCIe D2D Adapter & PHY Integrated IP
A UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
D2D Controller addon for D2D SR112G PHY with CXS interface
The Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…
The second-generation high-performance RISC-V CPU delivers a major leap in compute capability, designed for deployment across dat…
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications.
Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…
BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.
The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and…
Scalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
Scalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.