UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
- UCIe
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe Controller baseline for Streaming Protocols
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
Specifications: UCIe v1.0, v1.1, v2.0, v3.0 Interfaces: FDI/RDI/PHY link DUT Types/Topology D2D Adapter, Phy, Protocol, Full Stac…
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) for Automotive in TSMC (N5A)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…