UCIe IP Cores

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UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.

These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse

This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.

Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.

 
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Compare 57 UCIe IP Cores from 19 vendors

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Semiconductor IP