Vendor: Cadence Design Systems, Inc. Category: Multi-Protocol PHY

112G-XSR Pam4 for TSMC 7nm FinFET CMOS

Accelerating multi-die, multi-chip SoC designs The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of ei…

TSMC 7nm N7+ Silicon Proven View all specifications

Overview

Accelerating multi-die, multi-chip SoC designs

The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of eight lanes operating at 112Gigabit per second using PAM4 modulation. This IP enables die-to-die or die-to-optical engine connectivities for extremely low power and compact footprint. 112G-XSR SerDes is an enabling technology for chiplet and systemin-package (SiP) applications, which allows SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse. The 112G-XSR SerDes IP supports primary Ethernet data rates within +/- 200ppm. Each receiver includes clock-data-recovery (CDR) for tracking PPM offset. An integrated micro-controller allows for fully autonomous startup, adaptation, and service operation without requiring ASIC intervention. A programming and observation interface is provided via a parallel bus with MDIO-style addressing (port, device, address). There are several comprehensive on-chip diagnostic tools that enable testability and easy debugging. A post-equalized histogram is available for accurate estimation of bit error rate (BER) even in the absence of actual bit errors. Vertical eye statistics can be logged to allow optional optimization of the device settings.

Key features

  • TSMC 7nm FinFET CMOS Process
  • 112G PAM4 interface compatible to LR and VSR
  • Eight-lane compact footprint for high-density designs
  • Integrated BIST capable of producing and checking PRBS
  • OIF-CEI-112G-XSR standard compliance
  • Power-optimized for XSR links
  • Fully autonomous startup and adaptation without requiring ASIC intervention

Applications

  • Communications
  • Data Processing

What’s Included?

  • GDS II macros with abstract in LEF
  • Verilog post-layout netlist
  • STA scripts for use at chip or standalone PHY levels
  • Verilog models of I/O pads, and RTL for all PHY modules
  • SDF for back-annotated timing verification

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 7nm N7+ Silicon Proven

Specifications

Identity

Part Number
112G-XSR Pam4 for TSMC 7nm FinFET CMOS
Vendor
Cadence Design Systems, Inc.

Provider

Cadence Design Systems, Inc.
HQ: USA
If you want to achieve silicon success, let Cadence help you choose the right IP solution and capture its full value in your SoC design. Cadence® IP solutions offer the combined advantages of a high-quality portfolio, an open platform, a modern IP factory approach to quality, and a strong ecosystem. Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. The Cadence IP Portfolio includes silicon-proven Tensilica® IP cores, analog PHY interfaces, standards-based IP cores, verification IP cores, and other solutions as well as customization services for current and emerging industry standards. The Cadence IP Factory provides you with an automated approach to the customization, delivery, and verification of SoC IP. As a result, you can spend more time on differentiation, with the assurance that you'll meet your performance, power, and area requirements. Choosing Cadence IP enables you to design with confidence because you have more freedom to innovate your SoCs with less risk and faster time to market.

Learn more about Multi-Protocol PHY IP core

How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Increasingly, more of the focus on mobile has centered around cloud datacenters and the networking to get the data back and forth between these datacenters and the mobile device. Functions like voice recognition and mapping depend on the ability to split the functionality between the smartphone, for local processing like encryption and compression, and the back end, where a large number of servers can do the heavier lifting before returning the results.

One PHY, Zero Tradeoffs: Multi-Protocol PHY for Edge AI Interface Consolidation

The Cadence 10G multi-protocol PHY was architected to address this exact challenge. Designed to scale across multiple process nodes, it consolidates PCI Express (PCIe), USB, DisplayPort, Ethernet, and other interfaces into a single, compact, silicon-efficient block. What sets it apart is simultaneous multi-protocol support, which enables multiple data paths without duplicating hardware, requiring extra board connectors, or paying the area and power penalty of separate IP blocks.

Frequently asked questions about Multi-Protocol PHY IP cores

What is 112G-XSR Pam4 for TSMC 7nm FinFET CMOS?

112G-XSR Pam4 for TSMC 7nm FinFET CMOS is a Multi-Protocol PHY IP core from Cadence Design Systems, Inc. listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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