Chiplets Semiconductor IP News & Insights

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure

OPENEDGES Unveils UCIe Chiplet Controller IP, Expanding Design Portfolio

OPENEDGES Technology, Inc. (OPENEDGES), the leading provider of memory subsystem intellectual property (IP), today announced the launch of the Universal...

Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance

Strategic round puts Eliyan over $100M in investment raised to date, adds key support from venture arm of world’s leading foundry

NoCs and the transition to multi-die systems using chiplets

Monolithic dies have long been used in integrated circuit (IC) design, offering a compact and efficient solution for building application-specific...

Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions

Integrating Baya Systems' WeaveIP™ NoC, and Blue Cheetah BlueLynx™ Die-to-Die (D2D) PHY IP solves many of the complexities of chiplet interconnect,...

Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions

Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and...

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

Manmeet Walia (Synopsys), Manuel Mota (Synopsys), Erez Shaizaf (Alchip)

Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications

Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and...

System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging

Mirabilis Design announced today the full support for System-level UCIe IP and a architecture exploration platform for early Chiplet package design...

Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform

Achronix and Primemas today announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™...

YorChip announces Low Latency 200G Chiplet for edge AI

YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps.

SEMIFIVE Collaborates with OPENEDGES on Chiplet Development

This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6 memory subsystem, which includes...