NoCs and the transition to multi-die systems using chiplets
Monolithic dies have long been used in integrated circuit (IC) design, offering a compact and efficient solution for building application-specific...
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
Integrating Baya Systems' WeaveIP™ NoC, and Blue Cheetah BlueLynx™ Die-to-Die (D2D) PHY IP solves many of the complexities of chiplet interconnect,...
Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions
Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and...
Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets
Manmeet Walia (Synopsys), Manuel Mota (Synopsys), Erez Shaizaf (Alchip)
Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and...
System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
Mirabilis Design announced today the full support for System-level UCIe IP and a architecture exploration platform for early Chiplet package design...
Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
Achronix and Primemas today announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™...
YorChip announces Low Latency 200G Chiplet for edge AI
YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps.
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6 memory subsystem, which includes...
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced...
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
Alphawave Semi’s chiplet-based custom silicon design platform adds a differentiator in our portfolio that includes IO extension chiplets, memory...
Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital,...
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