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Strategic round puts Eliyan over $100M in investment raised to date, adds key support from venture arm of world’s leading foundry
Monolithic dies have long been used in integrated circuit (IC) design, offering a compact and efficient solution for building application-specific...
Integrating Baya Systems' WeaveIP™ NoC, and Blue Cheetah BlueLynx™ Die-to-Die (D2D) PHY IP solves many of the complexities of chiplet interconnect,...
Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and...
Manmeet Walia (Synopsys), Manuel Mota (Synopsys), Erez Shaizaf (Alchip)
Baya Systems today emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate complex single-die and...
Mirabilis Design announced today the full support for System-level UCIe IP and a architecture exploration platform for early Chiplet package design...
Achronix and Primemas today announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™...
YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps.
This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6 memory subsystem, which includes...
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced...
Alphawave Semi’s chiplet-based custom silicon design platform adds a differentiator in our portfolio that includes IO extension chiplets, memory...
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