Trending topic
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
Latest updates
Eliyan today announced the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module on Samsung Foundry’s SF4X 4nm advanced manufacturing...
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed...
ADTechnology has announced a collaboration with Samsung Foundry, Arm, and Rebellions to develop a next-generation AI CPU chiplet platform based on...
Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet technology
By Shivi Arora & Sue Hung Fung
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced it...
Faraday Technology today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform...
Movellus and Tenstorrent announced that Tenstorrent has licensed Movellus’ digital IP family as part of a strategic engagement, for its AI and HPC...
Alphawave Semi announces its CTO, Dr. Tony Chan Carusone, will deliver a speech on chiplets and connectivity at the 2024 AI Hardware & Edge AI Summit.
This paper focuses on how direct RF sampling architecture has proved to be a felicitous approach for RF data conversion. The progress in converter...
This topic page collects recent semiconductor IP updates, technical articles, expert perspectives and industry news related to Chiplets.
Use it to track relevant IP trends, ecosystem announcements, design technologies, standards, architectures and related IP categories inside Semi IP Hub.