Jumpstarting the Automotive Chiplet Ecosystem
Steve Brown, Cadence
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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161 results about Chiplets
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and...
Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
Alphawave Semi today announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s most advanced 3nm process.
The Automotive Industry's Next Leap: Why Chiplets Are the Fuel for Innovation
Steve Brown, Cadence
Cadence Sets the Gold Standard for UCIe Connectivity at Chiplet Summit '24
MBhatnagar, Cadence
Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan
Tenstorrent is pleased to announce a multi-tiered partnership deal with Japan's Leading-edge Semiconductor Technology Center (LSTC), which selected...
Ecosystem Collaboration Drives New AMBA Specification for Chiplets
Francisco Socal, Director, Product Management, Architecture and Technology Group, Arm
Arm Ecosystem Collaborates on Standards to Enable a Thriving Chiplet Market
Richard Grisenthwaite, EVP, Chief Architect & Fellow, Arm
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
Tenstorrent and Blue Cheetah Analog Design today announced that Tenstorrent has licensed Blue Cheetah's die-to-die interconnect IP for its AI and...
YorChip announces partnership with Digitho for enabling Secure Chiplets
The supply chain and security of Chiplets are critical to assuring Known Good Die (KGD) are being used in final assembly – one defective Chiplet...
Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations
Alphawave Semi and proteanTecs Collaborate to Provide System Insights and Analytics for Custom Silicon and Chiplets
proteanTecs, a global leader of deep data analytics for advanced electronics, announced today a partnership with Alphawave Semi (LSE: AWE), a global...
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