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The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital,...
Steve Brown, Cadence
The automotive reference design, initially for advanced driver assistance system (ADAS) applications, specifies a scalable chiplet architecture and...
Alphawave Semi today announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s most advanced 3nm process.
Steve Brown, Cadence
MBhatnagar, Cadence
Tenstorrent is pleased to announce a multi-tiered partnership deal with Japan's Leading-edge Semiconductor Technology Center (LSTC), which selected...
Francisco Socal, Director, Product Management, Architecture and Technology Group, Arm
Richard Grisenthwaite, EVP, Chief Architect & Fellow, Arm
Tenstorrent and Blue Cheetah Analog Design today announced that Tenstorrent has licensed Blue Cheetah's die-to-die interconnect IP for its AI and...
The supply chain and security of Chiplets are critical to assuring Known Good Die (KGD) are being used in final assembly – one defective Chiplet...
Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging implementations
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