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The company will develop chiplet-based modular accelerators that can accelerate large-scale AI services, including large-language models (LLMs),...
Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.
Using Samsung Foundry's SF4X 4nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system...
YorChip, Inc. announces development of a Universal PHY enabling customers to develop Open Chiplets and ASIC solutions using a single die-to-die PHY....
Enabling the Industry’s First 64 Gbps UCIe IPs following the Successful Tapeout of Alphawave Semi’s Gen2 36 Gbps UCIe IP on TSMC’s 3nm Technology,...
BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of industry’s...
Arteris Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Menta has deployed...
Alphawave Semi is pleased to announce that South Korean AI chip firm Rebellions Inc. has selected Alphawave Semi’s multiprotocol I/O Connectivity...
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet...
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation...
Eliyan today announced the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module on Samsung Foundry’s SF4X 4nm advanced manufacturing...
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed...
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