Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
Deploying AI at scale presents enormous challenges, with workloads demanding massive compute power and high-speed communication bandwidth.
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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161 results about Chiplets
Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
Using Samsung Foundry's SF4X 4nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system...
YorChip announces patent-pending Universal PHY for Open Chiplets
YorChip, Inc. announces development of a Universal PHY enabling customers to develop Open Chiplets and ASIC solutions using a single die-to-die PHY....
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Enabling the Industry’s First 64 Gbps UCIe IPs following the Successful Tapeout of Alphawave Semi’s Gen2 36 Gbps UCIe IP on TSMC’s 3nm Technology,...
BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of industry’s...
Arteris Deployed by Menta for Edge AI Chiplet Platform
Arteris Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Menta has deployed...
Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
Alphawave Semi is pleased to announce that South Korean AI chip firm Rebellions Inc. has selected Alphawave Semi’s multiprotocol I/O Connectivity...
Cadence Transforms Chiplet Technology with First Arm-Based System Chiplet
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet...
Cadence Unveils Arm-Based System Chiplet
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation...
Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Eliyan today announced the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module on Samsung Foundry’s SF4X 4nm advanced manufacturing...
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced Tenstorrent has licensed...
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
ADTechnology has announced a collaboration with Samsung Foundry, Arm, and Rebellions to develop a next-generation AI CPU chiplet platform based on...
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