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The new US entity will be led by Rachael J. Parker and David Johnston, expanding the Group’s global footprint alongside existing operations in the...
By leveraging TSMC’s SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and...
Breakthrough Gen3 UCIe IP subsystem achieves 64 Gbps per-I/O pin data rates and doubles shoreline bandwidth density, enabling scalable XPUs, and...
Deca Technologies and Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc. (NASDAQ:MCHP), announced today that they have...
Arteris’ FlexGen smart NoC IP will be utilized by AMD in semiconductor designs to enable improved product performance and efficiency.
Chiplet-based, multi-die systems are gaining traction as a compelling alternative to monolithic system-on-chip (SoC) designs. These architectures...
As chip design becomes increasingly complex with more components, higher performance demands and tighter timelines, Magillem Packaging helps engineering...
BOS Semiconductors is proud to announce our membership in VESA (Video Electronics Standards Association) and UCIe (Universal Chiplet Interconnect...
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node
Live demonstrations and technical sessions highlight Alphawave Semi’s role in shaping the future of PCIe technology for AI and high-performance compute
Leveraging Tetrivis’ proven KuKa® transceiver IP—already sampling on a 40 nm node for customer demonstrations—the partners will translate the design...
Explore Cadence's innovative chiplet technology in this video, highlighting the 40Gbps Ultralink solution for high-performance computing. Discover...
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