Trending topic
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
Latest updates
Leti and List, institutes of CEA-Tech, reported a high-performance processor breakthrough using an active interposer as a modular and energy- efficient...
Achronix, Cisco, Facebook, Netronome, NXP and zGlue shared details on the progress of their collaboration to validate technology and business opportunities...
Arm and TSMC, the High-Performance Computing (HPC) industry leaders, today announced an industry-first 7nm silicon-proven chiplet system based on...
eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will exhibit at...
Momentum continues to coalesce slowly around the creation of an open chiplet ecosystem, enabling the heterogeneous integration of chiplets from multiple...
CHIPLETs From Aurora VLSI Speed SOC Development
This topic page collects recent semiconductor IP updates, technical articles, expert perspectives and industry news related to Chiplets.
Use it to track relevant IP trends, ecosystem announcements, design technologies, standards, architectures and related IP categories inside Semi IP Hub.