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eTopus Technology today announces the design-in availability of its 7/6nm multi-protocol SerDes IP optimized for PCIe gen 1 to 6 SoC & Chiplet clients....
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung,...
Ventana Micro Systems announces a strategic partnership to make its RISC-V CPU cores and chiplets available through Intel Foundry Services (“IFS”)...
eTopus Technology today announced in partnership with QuickLogic and OpenFive, a platform of base IP that can be easily integrated by chiplet developers...
CEVA, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded...
Blue Cheetah, a leading provider of parallel chiplet interface solutions, announced the development of the BlueLynxTM Generator. BlueLynxTM produces...
As part of the collaboration, the Cadence® Integrity™ 3D-IC platform, the industry’s first unified platform for 3D-IC planning, implementation and...
Eric Esteve, IPnest
Alphawave IP, a global leader in high-speed connectivity for the world's leading technology infrastructure, announces production availability of...
Data center workloads are quickly evolving, demanding high compute density with varying mixes of compute, memory and IO capability. This is driving...
Chris Jones, Sifive
Credo today announced the production availability of Nutcracker, the industry's first low-power 3.2Tbps retimer XSR-enabled high-speed connectivity...
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