VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
VeriSilicon is one of the first enterprises in mainland China to join the organizationand will work with other members on research and adoption of...
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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162 results about Chiplets
eTopus Announces PCIe IP Gen 1-6 and 800G Support For 7/6nm With Support For SoC & Chiplet Clients
eTopus Technology today announces the design-in availability of its 7/6nm multi-protocol SerDes IP optimized for PCIe gen 1 to 6 SoC & Chiplet clients....
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung,...
Ventana Micro Systems Inc. Announces Strategic Partnership With Intel for Broader Commercialization of Its High-Performance RISC-V Cores and Chiplets
Ventana Micro Systems announces a strategic partnership to make its RISC-V CPU cores and chiplets available through Intel Foundry Services (“IFS”)...
eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets
eTopus Technology today announced in partnership with QuickLogic and OpenFive, a platform of base IP that can be easily integrated by chiplet developers...
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded...
Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
Blue Cheetah, a leading provider of parallel chiplet interface solutions, announced the development of the BlueLynxTM Generator. BlueLynxTM produces...
Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs
As part of the collaboration, the Cadence® Integrity™ 3D-IC platform, the industry’s first unified platform for 3D-IC planning, implementation and...
Chiplet: Are You Ready For Next Semiconductor Revolution?
Eric Esteve, IPnest
Alphawave IP announces production availability of new PCIe-CXL solution on TSMC N5 process for storage and broader chiplet market
Alphawave IP, a global leader in high-speed connectivity for the world's leading technology infrastructure, announces production availability of...
Chiplet Strategy is Key to Addressing Compute Density Challenges
Data center workloads are quickly evolving, demanding high compute density with varying mixes of compute, memory and IO capability. This is driving...
RISC-V Chiplets, Disaggregated Die, and Tiles
Chris Jones, Sifive
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