YMTC’s NAND Design Surprise Alongside a New Fab
China’s memory underdog defies sanctions by building a fab that mostly sources equipment, materials, and tools locally.
By Majeed Ahmad, EE Times | April 20, 2026

At a time when the U.S. trade sanctions aim to hamper China’s fabs from manufacturing cutting-edge logic and memory chips by restricting the supply of the latest fabrication equipment, materials, and tools, the news about Chinese chipmaker Yangtze Memory Technologies Corp. (YMTC) building new fabs comes with an element of surprise.
What makes it even more intriguing is the current memory chip crunch sparked by an unprecedented demand in what pundits call the golden era of AI infrastructure. Will this window of opportunity bring YMTC to the league of Kioxia, Micron, Samsung, and SK Hynix? Industry analysts are closely watching this memory resurgence from China at a critical technology juncture.
To read the full article, click here
Related Semiconductor IP
- AFDX 1G Switch IP
- AFDX 1G End-System IP
- Simplified Integration USB PD Capable Type-C Sink IP
- eFPGA on GlobalFoundries GF12LPP
- MIPI C‑PHY/D‑PHY IP on TSMC N2P
Related News
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
- Record Spending for Fab Equipment Expected in 2017 and 2018
- Record Fab Spending for 2017 and 2018
- 200mm Fabs Thriving; SEMI's Updated 200mm Fab Report Now Available
Latest News
- BrainChip Unveils Communication Reference Platform, Fueling Signal Intelligence at the Edge
- Qualinx and EUSPA announce the completion of full Galileo OSNMA support on QLX3Gx Series ultra-low power GNSS receiver.
- Ceva Launches Microsoft-Certified Spatial Audio Software for PC Gaming Headsets
- Nuclei and Lauterbach Successfully Complete World's First RISC-V Data Trace Solution
- Brite Semiconductor Releases 40nm 16-bit 4Msps High-Performance SAR ADC IP, Powering Industrial and Automotive Applications