Why TSMC Wants to Build a 12-inch Wafer Fab in China
Peter Brown, IHS Electronics360
December 09, 2015
It is not a secret that the Chinese central government is investing heavily in the semiconductor industry and is supporting Chinese venture capital firms in their bid to acquire chip companies outside of the country. That means there is ample opportunity emerging in the country to take advantage of what promises to be a vast revenue expanse. That’s why Taiwan Semiconductor Manufacturing Corp. (TSMC) has plans to build its first 12-inch wafer fab in China after submitting an application to the Investment Commission of Taiwan’s Ministry of Economic Affairs.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Huawei is hurrying to build a wafer fab
- A 10-cent RISC-V microcontroller from China? Why not?
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Quobly marks a new milestone towards industrialization with Soitec’s 28Si FD-SOI substrates now cycling in ST’s 300mm fab
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA