Wearable SoC: Let DSP Do 'Always Listening' Chores
Ceva makes the case with multifunction DSP
Junko Yoshida, EETimes
5/7/2014 07:55 PM EDT
MADISON, Wis. — Wearable devices are suffering from a fatal flaw: batteries that die too fast. Developers blame the problem on the dearth of tailor-made wearable SoCs that could meet their requirements.
With that in mind, if they were to develop their own wearable SoCs, what should be their priority?
On a system level, system designers first and foremost need to rethink displays. Will Strauss, president of Forward Concepts, said the biggest power drain in a cellphone is the screen. Switching "to black and white to save power when color is not needed" is one idea. Other power wasters include "keeping WiFi on when you're not near a hotspot."
On a silicon level, Linley Gwennap, principal analyst at Linley Group Inc., calls "higher power in the application processor" the main culprit in power drain. "Processors with four or eight cores, particularly big cores, are much more power hungry than the single- and dual-core processors from a couple of years ago." Choosing a low-power processor (CPU and/or DSP) combined with wireless communications (e.g., Bluetooth, WiFi, cellular) should be a high priority in wearable SoCs, he says.
To read the full article, click here
Related Semiconductor IP
- Vision 341 DSP
- Tensilica HiFi 3z DSP
- Tensilica HiFi 4 DSP
- High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
- Versatile, Ultra-Low-Power DSP for Audio, Voice, Vision, and AI
Related News
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC
- Ultra-miniature smart wireless microsystems hold key for wearable and implanted body area networks
- Broadcom Announces Bluetooth Smart SoC with Wireless Charging Support for Growing Wearable Market
- Ineda Systems Delivers Breakthrough Power Consumption for Wearable Devices and the Internet of Things
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools