Vendor: Cadence Design Systems, Inc. Category: DSP Core

Tensilica HiFi 3z DSP

Efficiently supports front-end audio processing like beamforming and noise reduction, as well as neural network-assisted speech r…

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Overview

Efficiently supports front-end audio processing like beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing.

The Cadence® Tensilica® HiFi 3z DSP raises the performance and energy efficiency over the HiFi 3 DSP when executing complex algorithms. Target applications include mobile, home entertainment, and automotive. As audio requirements for everything from smartphones to home stereo receivers to multi-speaker automotive configurations are being driven by advanced post-processing, the HiFi 3z DSP provides the right level of performance or such tasks while keeping the energy consumption at the lowest level.

Feature

HiFi 3z
VLIW Slots 3
Fixed-Point MACs per Cycle 32x32 2
24x24 4
32x16 4
16x16 up to 8
Accumulator 64-bit
VFPU Integrated 2-way SIMD Vector FPU
ITU Intrinsic Support Yes
Circular Buffer Support 1
Bitstream VLE/VLD Yes
User-Defined Instructions Yes

Key features

  • Flexible VLIW Bundle Instruction sizes
  • Up to 2 times more16x16 MACs compared to HiFi 3 DSP
  • On average 20% performance boost over HiFi 3 DSP

Block Diagram

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Benefits

DSP Performance

Significant (35%) performance boost over HiFi 1s

Energy Efficiency

Balanced area, cycle, and energy efficiency for high-complexity pre- and post-processing algorithms

Codec Performance

Well suited for object-based audio codecs, pre- and post-processing, and running VoLTE (EVS) speech codecs

Applications

Examples include wideband speech codecs for mobile, noise suppression in home and car, and immersive gaming with 32 streams of audio

ISO 26262 Compliant

Certified as ASIL compliant and equipped with both hardware and software safety mechanisms

Applications

  • Automotive,
  • Communications,
  • Consumer Electronics,
  • Data Processing,
  • Industrial and Medical,
  • Military/Civil Aerospace,
  • Others

Specifications

Identity

Part Number
HiFi 3z DSP
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Contact Cadence Design Systems, Inc.

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Building a high-performance, low-power audio/voice subsystem

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Frequently asked questions about DSP Core IP cores

What is Tensilica HiFi 3z DSP?

Tensilica HiFi 3z DSP is a DSP Core IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this DSP Core?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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