China's VeriSilicon Files For IPO
Peter Clarke, Electronics360
23 October 2014
VeriSilicon Holdings Co. Ltd. (Shanghai, China), a Chinese fabless chip company with a design service, IP licensing and chip delivery business model, has filed to raise $75 million from an initial public offering of shares on the NASDAQ market. This is despite the fact that the company made a net loss in the first half of 2014.
The company, describes its business model as Silicon Platform as a Service (SiPaaS) saying that it can provide services across the semiconductor value chain from design to delivery of chips by supplying intellectual property and design and outsourcing for manufacturing services as appropriate. With this model it serves fabless chip companies and so-called ODMs (original design manufacturers) and OEMs (original equipment manufacturers) working in the areas of smart phones, tablet computers, HDTVs, set-top boxes, DVD players, home gateways, networking and data centers.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market
- LogicVision reports 13% sequential growth in Q4 revenues after IPO
- TransEDA accelerates IPO timetable
- IPO part of TransEDA's acquisition strategy
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers