Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs
SAN JOSE, Calif., 16 May 2016 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) and Uurmi Systems today announced that Uurmi’s fog removal software targeted for automotive and camera markets is now available on the Cadence® Tensilica® Vision digital signal processor (DSP). By porting their fog removal software to the Tensilica Vision DSP, Uurmi achieved up to 5X higher performance, with 15X less power consumption.
Uurmi’s fog removal software eliminates fog present in the photo and applies correction to improve the image. It uses a spatial diffusion filtering-based approach with local contrast enhancement to remove fog during the image post-processing stage. It also offers fog correction for images captured from un-calibrated camera systems. Uurmi’s software provides fog correction with scene sharpness preservation and is capable of fog/non-fog region separation. For more information on Uurmi’s fog removal software, visit http://uurmi.com/multi-sensor-fusion-image-system.html.
The Tensilica family of imaging/vision DSPs was designed for the complex algorithms in imaging, video and computer vision applications, including innovative multi-frame image capture, video pre- and post-processing, object and face recognition, low-light enhancement and many other complex tasks. For more information, visit www.cadence.com/news/Uurmi.
“By porting our fog removal software to the Tensilica Vision DSP, we achieved dramatic improvements in power,” said Dr. Swarup Medasani, CTO at Uurmi Systems. “With a quick turnaround time, we achieved significant performance gains with low power consumption, which are critical differentiators in the ever-growing mobile, camera and security applications market.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
About UURMI
UURMI was founded by industry veterans with more than two decades of global experience. It specializes in R&D and product development, ensuring responsive customer support and cost-effective solutions. UURMI is committed to meeting our clients’ stringent requirements and delivering products with a significant time-to-market advantage in the most cost effective way. Our engineering delivery and leadership teams have significant experience at delivering products to Tier 1 companies, and ensure radical thinking, innovative solutions, world-class engineering disciplines, and unsurpassed quality of service. UURMI has been appraised at Level-3 of the CMMI Institute's Capability Maturity Model Integration (CMMI). For more information, please visit www.uurmi.com.
Related Semiconductor IP
- Vision 341 DSP
- Tensilica HiFi 3z DSP
- Tensilica HiFi 4 DSP
- High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
- Versatile, Ultra-Low-Power DSP for Audio, Voice, Vision, and AI
Related News
- Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
- Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip
- Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications
- Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
Latest News
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board
- OXMIQ Raises $35 Million to Scale OxCore™ Architecture
- SOC-E successfully showcases Time-Sensitive Networking (TSN) application for NGWS/FCAS Remote Carrier (Pillar 3)