TSMC raises capex to record $8.5 billion, pulls in 20-nm
Peter Clarke, EETimes
(4/26/2012 12:23 PM EDT)
LONDON – Taiwan Semiconductor Manufacturing Co. Ltd. has raised its planned capital expenditure for 2012 to between $8 billion and $8.5 billion. The move accompanied the announcement of first quarter financial results and strong second quarter outlook by the foundry.
TSMC (Hsinchu, Taiwan) said that it needed to increase capex because of stronger than expected demand for 28-nm wafers and because it has decided to "pull in" the creation of a 20-nm R&D process line.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Chartered still losing money, cuts capex
- ST to 're-deploy' 1,000 engineers amid Q1 losses, CapEx cuts
- TSMC Announces Move to 20nm Process
- Expected Top Ten IC Industry Capex Spenders In 2010
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder