TSMC says equipment vendors late for 14nm

EETimes (9/7/2011 6:08 AM EDT)

TAIPEI – Time is running out to make critical decisions for how to make 14nm chips expected to hit production in 2015, and capital equipment vendors are falling behind. That was the upshot of a talk by the top R&D executive at Taiwan Semiconductor Manufacturing Co.at Semicon Taiwan here.

TSMC believes it needs to move to next-generation lithography and 450mm wafers to make 14nm chips cost effectively, but capital equipment makers threaten to miss the foundry's schedule on both fronts. "Every day we become more and more concerned," said Shang-yi Chiang, senior vice president of R&D of TSMC.

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