This is How Intel Gets Out of Manufacturing
It won’t be easy, but it could be done
By Jim McGregor, Tirias Research
EETimes (February 2, 2021)
On the heels of activist hedge fund Third Point calling on Intel’s board to explore “strategic alternatives,” like spinning off its fabs and/or divesting itself of unsuccessful acquisitions, Intel’s board reacted with a rapid change of CEOs, tapping Pat Gelsinger to succeed Bob Swan. However, in his first address to the financial community, Gelsinger committed Intel to remaining an integrated design manufacturer (IDM) — and, yes, that might require outsourcing some manufacturing to third-party fabs in the near term. While this may not please some investors, it is the correct decision at this time. However, I have a theory on how a spinoff could be successful, theoretically, in the long-term, say five years or more down the road
To read the full article, click here
Related Semiconductor IP
- AXI to UCIe FDI Interface IP
- 45SPCLO UCIe-Class 1-32Gbps Low Power Receiver IP (NRZ)
- 45SPCLO UCIe-Class 1-32Gbps Low Power Transmitter IP (NRZ)
- Peripheral Sensor Interface (PSI5) Host Controller
- Link Acceleration Unit
Related News
- Comment: GloFo gets warm words, but for how long?
- How Investments in Manufacturing will Benefit the Semiconductor Ecosystem
- How Arm Total Design is built around 5 key building blocks
- Intel 18A Advanced Packaging is Key to Tech Leadership
Latest News
- onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
- EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
- Jim Keller: ‘AI Still Obeys the Old Laws of Compute’
- OpenAI and Broadcom unveil LLM-optimized inference chip
- RAAAM Selects Avnet ASIC as its VCA Partner for TSMC’s 2nm GCRAM Development and Qualification