Taiwan's Etron, TSMC claim smallest low-power 8-Mbit SRAM with 0.15-micron process
Taiwan's Etron, TSMC claim smallest low-power 8-Mbit SRAM with 0.15-micron process
By Semiconductor Business News
May 12, 2000 (8:50 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000512S0001
HSINCHU, Taiwan -- Etron Technology Inc. and chip foundry Taiwan Semiconductor Manufacturing Co. Ltd. here announced the world's smallest 8-megabit low-power SRAM -- a memory chip measuring less than 40 mm2. The 8-Mbit SRAM was developed by nine-year-old Etron, which claims to be Taiwan's largest fabless memory company. The chip is based on TSMC's 0.15-micron process technology. "TSMC is the first dedicated foundry to introduce a commercially available 0.15-micron process and to deliver wafers at that technology node," said Shang-Yi Chiang, vice president of R&D at TSMC. "Cooperating with Etron Technology, TSMC has manufactured the most competitive product on the market in the shortest period of time, demonstrating the powerful capabilities of our 0.15-micron process technology." According to Nicky Lu, chairman of Etron, the 8-Mbit low-power SRAM was fully functional "even in the first pilot lot and achieved high yield without re pair." He said Etron is confident the product will reach volume production in the third quarter of 2000 with high levels of yields. The memory operates at 1.5 and 1.8 volts, but matches the performance of other SRAMs running with 3-volt supplies, Lu said. "This chip is targeted for high-end cellular phones using the wireless application protocol (eWAP), this will enable system developers to march into more advanced eWAP generations," he added.
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums
- Winbond Electronics Corporation Signed a NT$ 15 Billion Syndicated Loan Agreement with Bank of Taiwan and Other 21 Financial Institutions
- IBM Builds World's Smallest SRAM Memory Cell
- Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process
Latest News
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip