Spansion and UMC Announce Joint Technology Development and Licensing Agreement

Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics

SUNNYVALE, Calif. and Hsinchu, Taiwan -- March 4, 2013 – Spansion Inc. (NYSE: CODE), a leading innovator of Flash memory solutions, and United Microelectronics Corporation (“UMC”), today announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT) Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.

Spansion embedded Charge Trap is a new high performance, low power, and cost- effective NOR Flash technology optimized for integration with advanced logic process in system-on-chip (SoC) products.  The technology is scalable beyond 40nm and can be integrated into High-k manufacturing process.  Products based on Spansion eCT will drive the development of faster, more intelligent connected technologies in industrial, automotive and consumer applications. Spansion eCT technology is a key enabler for expanding the roadmap for Spansion’s Programmable System Solutions (PSS), which combine Flash memory with configurable logic to enhance processing performance for applications that are memory, processing and MIPS intensive.

"Collaborating with UMC furthers Spansion's licensing strategy," said John Kispert, president and CEO of Spansion. "By working with a leading foundry such as UMC, we can more effectively expand our PSS product roadmap and licensing business. In addition, we will enable others to take advantage of our Charge Trap technology, extending into new markets and bringing additional value to our customers."

W.Y. Chen, COO of UMC, said, “We look forward to working with Spansion to offer an industry leading logic platform that integrates our robust 40nm production process with their well established Charge Trap memory technology. The result of the collaboration will deliver a cost-effective, innovative technology solution for customers designing into a wide range of market segments.”

About Spansion

Spansion (NYSE: CODE) is a leading provider of the Flash memory technology at the heart of the world's electronics systems, powering everything from the routers that run the internet to the highly interactive and immersive consumer and automotive electronics that are enriching people's daily lives. Spansion's broad and differentiated Flash memory product portfolio, award-winning MirrorBit charge-trapping technology, and industry leading service and support are enabling customers to achieve greater efficiency and success in their target markets. For more information, visit http://www.spansion.com.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s robust foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, China, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.