Quality, easy integration are on IP 'must have' list
Ron Wilson, EE Times
(12/12/2005 9:00 AM EST)
Increasing cost and complexity in semiconductor intellectual property has forced system-on-chip (SoC) manufacturers to examine the make-vs.-buy trade-off with renewed interest. However, while those trends have mitigated some of the risks associated with new IP development, new challenges have crept up. The challenge going forward is one of IP selection by teams with partial or nonexistent expertise in the IP cores being considered.
Some of the key areas where we see IP selection trends evolving over the next two to three years are in IP quality evaluation, ease of IP integration, performance validation, signaling of vendor maturity and the ability to easily reconfigure IP. Our predictions for the future in these areas are presented below.
(12/12/2005 9:00 AM EST)
Increasing cost and complexity in semiconductor intellectual property has forced system-on-chip (SoC) manufacturers to examine the make-vs.-buy trade-off with renewed interest. However, while those trends have mitigated some of the risks associated with new IP development, new challenges have crept up. The challenge going forward is one of IP selection by teams with partial or nonexistent expertise in the IP cores being considered.
Some of the key areas where we see IP selection trends evolving over the next two to three years are in IP quality evaluation, ease of IP integration, performance validation, signaling of vendor maturity and the ability to easily reconfigure IP. Our predictions for the future in these areas are presented below.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- CAST Introduces JPEG XL Encoder IP Core for High- Quality, On-Camera Still-Image Compression
- TTTECH releases 10 Gbit TSN-End Point IP Integration Kit to enable rapid TSN adoption in mission-critical applications
- CAST Introduces PDM-to-PCM IP Core for Easy Interfacing of Digital Microphones with SoCs
- SkyeChip’s UCIe 3.0 Advanced Package PHY IP for SF4X Listed on Samsung Foundry CONNECT
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release