ARM's East cites power as key IC design driver
Peter Clarke, EETimes
11/2/2012 12:15 PM EDT
SANTA CLARA, Calif. – The prospect of both climate change and "unsustainable" data growth means engineers should focus on reducing power consumption in their device designs, according to Warren East, CEO of ARM
In an ARM TechCon keynote here Thursday (Nov. 1), East sketched a future of vastly different design considerations that span everything from servers and cloud infrastructure to the billions of devices that will comprise the Internet of Things. East also used the keynote to announce that ARM is becoming a promoter member of the Weightless Special Interest Group that was originally created by Neul Ltd., a startup company that also comes from Cambridge, England.
To read the full article, click here
Related Semiconductor IP
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
Related News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries’ 22FDX
- Comcores supports BAE systems as a key partner with JESD204C IP
- EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board