Oki plans CMOS single-chip Bluetooth solution
Oki plans CMOS single-chip Bluetooth solution
By Yoshiko Hara, EE Times
June 23, 2000 (12:46 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000623S0019
TOKYO ( ChipWire) -- Oki Electric Industry Co. Ltd. has developed a full CMOS Bluetooth chip set and intends to offer it as part of a total Bluetooth solution this July with development tools and software co-developed with Widcomm Inc. in San Diego. Volume production of the chip set will begin early next year. The chip set consists of a CMOS RF transceiver and a baseband controller. "The RF LSI realizes 2.4-GHz high-frequency communication capability with a full CMOS process," said Masayoshi Ino, managing director of Oki Electric Industry. The CMOS RF transceiver will make it relatively easy to create a single-chip solution that integrates the digital baseband chip, he said. The RF transceiver comes in a 48-pin BGA that measures 7 square millimeters. The baseband chip, packaged in a 144-pin BGA measuring 11 mm square, has a 32-bit ARM RISC processor as a core and a PCM-CVSD (contin uous variable slope delta modulation) transcoder for voice communications. It also includes a UART as well as USB, PCM and JTAG interfaces. On the software side, Oki has licensed protocol stacks from Widcomm and combined them with its internally-developed wireless communication control software. The capabilities of the software package ranges from a basic level of support for a host control interface to the application level. Oki plans for its sales of Bluetooth products to reach about $100 million in the fiscal 2002.
Related Semiconductor IP
- ASA Motion Link PHY
- Configurable CNN accelerator
- RISC-V Display Connectivity Subsystem (DCS)
- AES-GCM - Authenticated Encryption and Decryption
- AES-GCM Authenticated Encryption and Decryption
Related News
- Intel Plans A Future of CMOS
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- Rohde & Schwarz and Ceva Present Industry’s First Test Solution for the Upcoming Bluetooth OTA UTP Test Mode
Latest News
- Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership
- M31 Gains Momentum in Advanced Processes, Targets Double-Digit Growth in 2026
- SCALINX Joins GlobalFoundries GlobalSolutions Ecosystem to Expand High-Speed Data Converter SoC Solutions
- TSMC April 2026 Revenue Report
- UMC Reports Sales for April 2026