Micron Cuts Capex, Wafer Starts
The company also resumed shipping some products to Huawei
By Dylan McGrath, EETimes
June 26, 2019
SAN FRANCISCO — U.S. memory chip supplier Micron Technology said that it would reduce its capital-spending plans for fiscal 2019 and 2020 and further trim wafer starts amid an ongoing demand slowdown that has thrown the memory market into a tailspin.
Micron said that it would slash capital spending for its fiscal 2019, which closes in August, to about $9 billion, down about 10% from the company’s estimate of about $10.5 billion at the start of the fiscal year. Micron said that it expects its fiscal 2020 capital expenditures to be “meaningfully lower” than fiscal 2019.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Chartered still losing money, cuts capex
- ST to 're-deploy' 1,000 engineers amid Q1 losses, CapEx cuts
- TSMC Cuts Capex by $1 Billion
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release