North American Semiconductor Equipment Industry Posts May 2020 Billings
MILPITAS, Calif. — June 18, 2020 — North America-based manufacturers of semiconductor equipment posted $2.35 billion in billings worldwide in May 2020 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.9 percent higher than the final April 2020 level of $2.28 billion, and is 13.1 percent higher than the May 2019 billings level of $2.07 billion.
"Despite COVID-19 headwinds and limited visibility to near-term macroeconomic conditions, May billings of North America-based semiconductor equipment manufacturers continue to demonstrate the semiconductor industry’s long-term resiliency,” said Ajit Manocha, SEMI president and CEO.
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
| Billings | Year-Over-Year | |
| December 2019 | $2,491.7 | 17.8% |
| January 2020 | $2,340.2 | 22.7% |
| February 2020 | $2,374.6 | 26.6% |
| March | $2,213.1 | 20.1% |
| April (final) | $2,281.3 | 18.2% |
| May (prelim) | $2,346.4 | 13.1% |
Source: SEMI (www.semi.org), June 2020
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.
Related Semiconductor IP
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
Related News
- North American Semiconductor Equipment Industry Posts May 2018 Billings
- North American Semiconductor Equipment Industry Posts May 2019 Billings
- North American Semiconductor Equipment Industry Posts July 2020 Billings
- Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board