Kilopass to Demonstrate Embedded Non-Volatile Memory IP at IIC-China 2015 Fall Exhibition
Will Feature eNVM’s Ultra Low Power, High Performance, Fast Access Speed, Megabits of Capacity, 10-Year Data Retention, Flexible Programming
SAN JOSE, CALIF. –– August 24, 2015 ––
WHO: Kilopass Technology, Inc., the leading provider of semiconductor embedded non-volatile memory (eNVM) intellectual property (IP)
WHAT: Will demonstrate its antifuse eNVM IP’s ultra-low power and high-performance features, fast access speed, megabits of capacity, more than 10 years of data retention and flexible programming options, at the IIC-China 2015 Fall Exhibition in Booth #3E08
WHEN: Monday, August 31, through Thursday, September 3, from 9 a.m. until 5 p.m.
WHERE: Shenzhen Convention & Exhibition Center, Shenzhen, China
The Kilopass website with information about its portfolio of eNVM IP can be found at: www.kilopass.com
About Kilopass
Kilopass Technology, Inc., is the leader in embedded non-volatile memory (NVM) intellectual property (IP). Its patented technologies of one-time programmable (OTP) NVM solutions have boundless capacity to scale to advanced CMOS process geometries. They are portable to every major foundry and integrated device manufacturer (IDM), and meet market demands for increased integration, higher densities, lower cost, low-power management, better reliability and improved security. Trusted by today's best-known brands, Kilopass' technology has been integrated by more than 170 customers, with 10-billion units shipped in over 400 industrial, automotive, consumer electronics, mobile, analog and mixed-signal, and internet of things (IoT) chip designs. For more information, visit www.kilopass.com or email info@kilopass.com
Related Semiconductor IP
- ReRAM NVM in DB HiTek 130nm BCD
- Universal NVM Express Controller (UNEX)
- NVM MTP EEPROM TSMC 65nm LP 2.5V SVT, SVT/HVT
- NVM MTP EEPROM TSMC 40nm LP 2.5V
- NVM MTP EEPROM TSMC 180nm BCDG2 5V
Related News
- intoPIX showcases UHDTV Hybrid SDI/IP Interoperability using TICO lightweight compression at the SMPTE 2015 Annual Technical Conference and Exhibition.
- Sales rise at TSMC, fall at UMC
- EDA vendors fall short on innovation, speaker says <!-- verification -->
- Wafer prices fall 6% in Q1, FSA says
Latest News
- Arteris Deployed by Speedata for Data Center Compute
- Siemens to acquire Defacto Technologies to complement its EDA portfolio with automated SoC design creation
- Mach42 Completes £7M Funding Round, Led by IP Group With Investment From BGF and Foresight Group
- ELECTRA IC Unveils Comprehensive IP Core Suite for Next-Generation Post-Quantum Cryptography
- CAST Enhances Serial Memory Controller IP with Encryption, Low-Power, and ASIL-Ready Options