ISSCC: Hitachi to market SH3 as IP core
ISSCC: Hitachi to market SH3 as IP core
By Stephan Ohr, EE Times
February 18, 1999 (5:05 p.m. EST)
URL: http://www.eetimes.com/story/OEG19990218S0014
SAN FRANCISCO Hitachi Semiconductor (America) Inc. has quietly let it be known at ISSCC this week that it would soon market its SH3-DSP chip as a synthesizable core. The device, which combines a 32-bit, 133-MHz microprocessor with a 133-Mips digital signal processor, is currently available only as a packaged part (the SH7729). The maneuver is intended to make the SH3-DSP more competitive with the ARM and Oak DSP cores, which are available as highly customizable soft cores, said Peter Clark, president and chief executive officer.
But there will be differences between the cores Hitachi will introduce later this year and the original SH3, said marketing manager David Pelavin. For one, synthesizable cores tend to be larger than the hardwired device. "You get flexibility at the expense of chip size," Pelavin said. The embedded device will likely be larger still.
Hitachi will probably streamline the DSP, tweaking the arithmetic logic u nit and multiply-accumulate unit for efficiency and lower power consumption per cycle. The DSP and the CPU are tightly coupled in the SH7729, with DSP operations culled automatically from the CPU instructions.
The device would be supported with memory-management units, caches and similar peripherals. The goal is to make the SH3-DSP useful for Windows CE machines and other appliances, Pelavin said.
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs
- CAST Introduces PDM-to-PCM IP Core for Easy Interfacing of Digital Microphones with SoCs
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- DCD-SEMI expands CryptOne with EdDSA Curve25519 IP core for secure embedded systems
Latest News
- intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure