Intel plans to crush ARM beyond 20-nm
Sylvie Barak, EETimes
9/24/2012 7:01 AM EDT
LONDON--Though ARM may currently have an indisputable advantage in low power processing, Intel believes it could eventually take the lead if it maintains its current pace of advancement in process technology.
Speaking to the firm’s executive vice president and head of architecture David (Dadi) Perlmutter recently, EE Times learned that Intel is pushing ahead with its sub 20-nm and 14-nm plans, while the ARM ecosystem struggles to find a business model beyond 22-nm.
Intel is biding its time. The semi giant appears quite prepared to wait a couple of generations until sub 20-nm nodes are breached before bringing the battle of low processing to ARM and its mobile minions.
To read the full article, click here
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond
- Alphawave IP Announces Record FY2019, Record 1Q2020 and Dramatic Hiring Plans for Remainder of 2020 and beyond
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
- SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder