Creating a Center of Excellence for IC Design
By Kevin Koh, Faraday Vietnam
EETimes (June 28, 2024)
Amidst the recent, intense discussion of semiconductor supply chains, one key element is often overlooked: the need for alternative sources of design expertise. Traditionally, an advanced system-on-chip (SoC) design is achievable in only a few geographic clusters of expertise formed around an outstanding university engineering model—and thriving symbiotically with it.
However, the demand for advanced chip designs is outgrowing the capacities of these legacy clusters, as skilled engineers are scarce. Meanwhile, global trade uncertainties are pressuring organizations to diversify or near-shore their supply chains. Additionally, the escalating demand for innovative new IC designs for AI, edge devices and data centers intensified the global need for more chip designers.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024
- StarIC opens design center in The Netherlands
- TSMC to Open EU Design Center in Munich in Q3
- Robust AI Demand Drives 6% QoQ Growth in Revenue for Top 10 Global IC Design Companies in 1Q25
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release