TSMC to Open EU Design Center in Munich in Q3
By Nitin Dahad, EETimes | May 27, 2025
At its 2025 Europe Technology Symposium in Amsterdam, The Netherlands, TSMC announced that it is establishing a European design center in Munich, scheduled to open in Q3 2025 in order to support its European customers.
The company said that this will be its tenth design center, joining a network of design centers across Taiwan, the U.S., Canada, mainland China and Japan. TSMC said it chose Munich rather than Dresden—the latter is where it is building a fab for the N16 and N28 families—because Munich is close to its European customers.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- EnSilica joins TSMC Design Center Alliance
- StarIC opens design center in The Netherlands
- TSMC looks to 5nm MRAM, plans first European design centre
- Andes Technology Advances High-Performance RISC-V Strategy with U.S.-based Design Center: Condor Computing
Latest News
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release
- IC Manage Advances GDP-AI for Custom IC Design with Virtuoso