TSMC to Open EU Design Center in Munich in Q3
By Nitin Dahad, EETimes | May 27, 2025
The company said that this will be its tenth design center, joining a network of design centers across Taiwan, the U.S., Canada, mainland China and Japan. TSMC said it chose Munich rather than Dresden—the latter is where it is building a fab for the N16 and N28 families—because Munich is close to its European customers.
To read the full article, click here
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 3.3V Capable GPIO on TSMC 28nm RF HPC+
- 1.2V Thin Oxide GPIO on TSMC 28nm RF HPC+
- LDO Voltage Regulator, 250 mA, TSMC N3P
- LDO Voltage Regulator, Adjustable 0.45 V to 0.9 V Output, 30 mA, TSMC N3P
Related News
- Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
- Safe and Secure Technologies, the new BSC and UPC spin-off that will design chips for critical sectors where “failure is not an option”
- Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools