TSMC to Open EU Design Center in Munich in Q3
By Nitin Dahad, EETimes | May 27, 2025
At its 2025 Europe Technology Symposium in Amsterdam, The Netherlands, TSMC announced that it is establishing a European design center in Munich, scheduled to open in Q3 2025 in order to support its European customers.
The company said that this will be its tenth design center, joining a network of design centers across Taiwan, the U.S., Canada, mainland China and Japan. TSMC said it chose Munich rather than Dresden—the latter is where it is building a fab for the N16 and N28 families—because Munich is close to its European customers.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Andes Technology Advances High-Performance RISC-V Strategy with U.S.-based Design Center: Condor Computing
- 2025 TSMC OIP Ecosystem Forum Highlights Aion Silicon’s Leadership in Advanced SoC Design
- Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA