Intel ramps hardware-software codesign research
Peter Clarke, EETimes
3/17/2011 6:27 AM EDT
"It's a closed research project but it's going really well," said Professor Martin Curley, director of Intel Labs Europe, speaking at a press event here.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Space Codesign Introduces the First Virtual Platform Technology Supporting Hardware/Software Codesign for FPGA Based on ARM Cortex-A9
- STMicroelectronics selects Cadence's Virtual Component Co-Design (VCC) <!-- verification -->
- TNI and Valiosys develops system level formal verification and co-design solutions.
- Codesign, co-verification applied to DSP core
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release