STMicroelectronics selects Cadence's Virtual Component Co-Design (VCC) <!-- verification -->
STMicroelectronics selects Cadence
By David Larner, Embedded Systems
November 19, 2001 (4:50 a.m. EST)
URL: http://www.eetimes.com/story/OEG20011119S0002
STMicroelectronics has announced that it has selected Cadence's Virtual Component Co-Design (VCC) for both its Automotive and Digital Consumer platform system-level design methodology and design flow. STMicroelectronics' Audio & Automotive Division uses VCC for behavioural modelling and architectural exploration in automotive design flows. For ST's new power train architecture project, VCC addresses those system-level parts of the design flow that significantly influence SoC size and complexity. This includes behavioural modelling and architecture exploration to enable knowledge transfer with internal and external system customers, and design refinement and export to implementation-level co-verification. STMicroelectronics, one of the world's largest semiconductor manufacturers and a leading supplier of system-on-chip (SoC) solutions, was one of the original VCC development partners.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- ProximusDA teams with STMicroelectronics to develop next-generation distributed SOC TLM virtual prototypes
- Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Mirabilis Design Signs OEM Agreement with Cadence to Deliver VisualSim for System-Level Modeling and Performance Optimization
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles