FDSOI Gains Design Wins Amid Fab Partner Mystery
Peter Clarke, Electronics360
28 January 2014
European chip company STMicroelectronics NV is gaining design wins for its 28nm fully depleted silicon-on-insulator (FDSOI) manufacturing process but is being coy about who will be its initial partner for high volume manufacturing. The date for the start of second-source volume manufacturing of FDSOI chips also appears to have slipped.
Jean-Marc Chery, executive vice president and general manager of embedded processing solutions at ST, told Electronics 360 that the number of FDSOI IC designs in development has risen to 15. That number stood at three about eight months ago. But he also declined to discuss progress at Globalfoundries in bringing up high volume manufacturing capacity of FDSOI chips.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Silicon Image Reference Design Partnership with MediaTek Gains Additional MHL Smartphone Design Wins
- GF Grabs AI Wins with FD-SOI
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
- Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools