Executive Insight: Grant Pierce
Ed Sperling, Semiconductor Engineering
May 29th, 2014
Sonics’ president and CEO sounds off about startup exit strategies, the Internet of Things, competing for highly trained systems engineers, and future opportunities.
Related Semiconductor IP
- On-chip ESD/EOS/Latch up/EMC protection for high voltage and BCD processes
- Robust circuit and interface solutions
- TSMC 40nm 5V GPIO
- TSMC 22nm 1.0V, 1.2V & 1.8V GPIO
- GlobalFoundries 22nm 3V3 GPIO
Related News
- Executive Insight: Charlie Cheng
- Executive Insight: Charles Janac
- Executive Insight: Hossein Yassaie
- Intel likely to grant Pentium 4 licenses to DDR chip set suppliers
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools