EU chip plan would cost €500bn, says NXP CEO
By David Manners, ElectronicsWeekly (October 4, 2022)
The EU will need ten times more than its budget if it wants to get 20% of the world chip market by 2030, Kurt Sievers, CEO of NXP, told the Globalfoundries’ Technical Summit in Dresden.
The EU has put forward a $52 billion Chips Act to hike European market share from 10% to 20%.
“We have calculated that we would need €500 billion investment in Europe to reach the 20% market share goal formulated in the EU Chips Act,” said Sievers , “reaching 20% world market share coming from 10% requires tripling or quadrupling our capacities.”
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Lattice Semiconductor Announces CEO Succession Plan
- CEVA, Inc. Announces CEO Transition Plan
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release