EnSilica: Automotive Manufacturing and Supply Contract Win

Expected to deliver $75 million in revenue over 7 years

June 1, 2026 -- EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce a new 7 year manufacturing and supply contract to produce an Arm based sensing chip for a German manufacturer of automotive components (the "Contract").

EnSilica was awarded the Contract after completing a competitive tender process. As the chip is already in production, no design or tape-out is required. EnSilica will now be responsible for the manufacturing and supply of the chip to the customer.

The Contract is expected to generate around $75 million in revenue over seven years, with approximately $4 million of revenue expected in the financial year ending 31 May 2027, with a gross margin reflecting the manufacturing-only nature of the Contract.

EnSilica was selected over a number of competing suppliers, reflecting the Company's growing expertise in the automotive sector and track record of delivering chip production at scale.

Ian Lankshear, CEO of EnSilica, commented:  "We are pleased to have secured this Contract, which will not only generate material future revenues but is expected to also deliver significant strategic benefits for EnSilica.

The Contract opens up a connection to a Tier 1 German automotive supply chain, increases wafer volume shipments through our partner foundries - reinforcing our position as a key customer - and it secures the VDA-aligned automotive quality standard required to operate within the German automotive sector.

It also places EnSilica in a stronger position to secure future higher-margin ASIC design opportunities in this important market."

Explore EnSilica IP:

• PQC CRYSTALS core for accelerating NIST FIPS 202 FIPS 203 and FIPS 204
• Radar processing IP suite for Advanced Driver Assistance Systems
• APB peripheral implementing the functionality of the ETSI TS 102613 V7.9.0 (2011-03) MAC Layer

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.