Tiny Tapeout hit as eFabless closes
By Nick Flaherty, eeNews Europe (March 2, 2025)
Open source chip pioneer eFabless has shut down over the weekend, hitting the latest shuttle runs for the Tiny Tapeout project.
eFabless, based in Palo Alto, California, had been struggling to raise funds in recent months. “Unfortunately, despite our best efforts, we were unable to complete our latest funding round, As a result, eFabless has shut down operations until further notice,” said Mike Wishart, CEO of eFabless, which provided an open source chip design flow as well as wafer shuttle services.
The company supported the Tiny Tapeout project that allows chip makers to use a multi-project wafer service for a few dollars. The current call is for designs for the TT10 run on the 130nm process at Skywater Technology..
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- RF startup Sequoia Communications shuts down
- ARM server chip pioneer Calxeda shuts down
- UMC may be forced to shut new fab pending EPA approval
- Virage Logic Drives Down Overall SOC Costs, While Targeting Higher Yielding Designs
Latest News
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility