Dream Chip Technology Becomes Tensilica System-on-Chip (SOC) Design Center Partner
Garbsen, Germany - July 12, 2011 - Tensilica, Inc. today announced that Dream Chip Technologies (DCT), of Garbsen, Germany, has joined Tensilica's Xtensions partner network and become an authorized design center. As a Tensilica Xtensions partner, DCT will support customers on Tensilica's Xtensa processor IP (intellectual property) cores, particularly for complex multimedia designs. DCT's engineers have extensive experience using Tensilica's processors in SOC (system-on-chip) designs.
"DCT has expertise in Tensilica technology so they can assist our mutual customers in getting to market quickly," stated Chris Jones, Tensilica's director of marketing. "They have a wealth of experience in low-power multimedia designs."
"Programmable designs have become more and more popular in the industry and Tensilica is offering the processor flexibility that customers require, complemented by an excellent tool chain," according to Peter Schaper, CEO of DCT. He added, "With our strong team and our expertise in TIE development, we are looking forward to supporting Tensilica's customers in Europe."
About Dream Chip Technologies
Dream Chip Technologies is a German engineering company supporting their European customers with SOC, FPGA, and embedded software designs for the consumer, industrial and automotive industry. DCT has a strong record in image and video processing developments, for more information please visit www.dreamchip.de
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers,storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
- Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design
- Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools