Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
Kaiserslautern, Germany, January 08, 2024 – Creonic GmbH is pleased to announce its official membership as a supporting partner of the Science and Innovation Alliance Kaiserslautern (SIAK). This collaboration underlines Creonic's commitment to fostering innovation and scientific progress within the region.
SIAK is a consortium of leading companies, research institutions, and educational establishments in Kaiserslautern, focused on enhancing collaboration between industry and academia. As a supporting member, Creonic will actively participate in initiatives aimed at supporting technology transfer and innovation in the region.
"Becoming a member of the Science and Innovation Alliance Kaiserslautern strengthens our ties to the local science and technology community," declared Timo Lehnigk-Emden, CEO of Creonic GmbH. "We look forward to working together on projects that have the potential to shape the technology landscape in our region sustainably."
This partnership provides Creonic with the opportunity to share its expertise and resources with other SIAK members and collaboratively develop innovative solutions. By working closely with research institutions and companies in Kaiserslautern, Creonic aims to contribute to strengthening the regional innovation ecosystem.
Creonic GmbH is eager to collaborate with SIAK and believes that this partnership will contribute significantly to boosting the region's innovation capabilities and competitiveness.
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- Wind River Joins the CHERI Alliance and Collaborates with Innovate UK to Accelerate Cybersecurity Innovation
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
- Ausdia Joins TSMC Open Innovation Platform® (OIP) EDA Alliance
Latest News
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer